19 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module connector for microsd card (hinge cover type) schb s eries hinge cover type with improved card retention. locking mechanism prevents the card from dropping during use. ? features for mobile phones ? applications microsd card standard mount surface mounting type manual insertion/removal 500v ac 1minute applicable media structure items specifications media ejection structure mounting type mounting style 20 ? to 70 ? 1,000m
min. 100m
max. 5,000cycles operating temperature range performance contact resistance initial insertion and removal cycle voltage proof insulation resistance initial typical specifications standard mount media ejection structure manual insertion/removal mounting system stand-off mm 0 packing system taping product no. SCHB1A0205 product line
20 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module for memory stick
13.3 14.6 1.93 no. 1 no. 8 no. 7 no. 6 no. 5 no. 4 no. 3 no. 2 4-1.4 0.3 8- 11.95 3.65 3.2 9.8 13.65 pitch 7-1.1 ? area for vacuum connector center 15 dimensions pc board mounting hole dimensions viewed from the mounting face side unit:mm style connector for microsd card (hinge cover type) schb series
50 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module for memory stick soldering conditions example of reflow soldering condition reference 1. heating method: double heating method with infrared heater. 2. temperature measurement: thermocouple 0.1 to 0.2 ca k or cc t . 3. temperature profile surface of products 200 100 240 ? (max.) 230 ? (min.) 150 ? 180 ? time (s) 10 sec.(max.) 90 ? 30 sec. room temperature temperature (?c ) pre-heating heating time sec. 1. when soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. caution is therefore required. 2. avoid use of water-soluble soldering flux, since it may corrode the product. 3. check and conform to reflow soldering requirements under actual mass production conditions. 4. pc board warping may alter the characteristics. please take this into consideration when designing patterns and layout. 5. the card specifications are provided by the above manufactures. products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. cautions for using this product small memory card connectors
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